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Vacuum compatible transfer systems include 200mm, 300mm, 450mm or custom load locks, single-wafer or cassette-based, manual and automated wafer transport systems. Along with semiconductor wafer transfer, they are readily adapted for other substrate transfer such as magnetic media, sample or reticle transfer and can be incorporated into standard or non-standard process modules.

Modification of standard products and a wide range of custom systems and vacuum components have been provided to meet special applications.
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Transfer Engineering designs and manufactures UHV, HV and ultra-clean transfer systems to meet specific customer needs. We believe the key to providing the best product solution is to work closely with customers to understand their process and objectives and to involve them in the product design to ensure that goals are met.
These high-vacuum compatible loadlocks are designed to load wafers or other substrates into a SEMI-MESC compatible or custom process modules. Using unique magnetically coupled transfer devices, wafers can be repeatedly loaded and removed without breaking vacuum. Along with the standard product lines shown, Transfer Engineering can make modifications to standard products or design completely custom systems to meet specific customer needs. Let us know your requirements.
A major portion of Transfer Engineering business involves modification to standard products or developing completely customized systems to meet unique customer requirements. Years of experience and expertise working in UHV has led to customer requests for a wide variety of systems for use in high vacuum, ultra-high vacuum or controlled environments.
Transfer Engineerings line of patented Precision Magnetic Manipulator (PMM) devices are used in high and ultra-high vacuum and controlled environment applications such as thin film process tools, analytical systems and surface science research tools. PMMs are precise, robust and low maintenance.
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